AOYI maintains strict environmental controls at our three global operational facilities. We protect your products across all stages of the supply chain.

The testing capabilities and procedures utilized include the following:

Visual Inspection

External visual inspection is a process of verifying the attributes of parts such as components condition, part markings, evidence of a secondary coating, lead conditions, dimensions and surface quality. Visual inspection is performed per SAE AS5553 and MIL-STD-883 Method 2009.9 and on a sample parts from a given lot.

Decap or De-lid

Decapsulation is to chemically etch a device until the die is exposed. Once exposed a device may be confirmed by reading the internal die markings under a microscope. In some events a die marking will correlate with a devices external markings.

Heated Chemical

-Confirms secondary coating

-Exposes bead blasting marks

-Exposes sanding marks

-Shows previous markings

-Dissolves partially cured resins

-Exposes pull marks and chips

XRF

XRF can be carried out on parts to evaluate the material composition of the terminations and the molding compound in order to detect the presence or absence of Pb and other discrepancies with an authentic part. This is a non-destructive test. A complete graph will be providing with a list of substances found. 

X-Ray Analysis

X-ray inspection is a non-destructive test. It is a process to verify the bond wire connections, die size comparison and ESD damaged. Our typical sample lot check is 5 samples or 100% depending customer requirement. Counterfeit devices can be determined by comparing the structure of the die to a known good device. Part should be identical from bond wire location to die size.

Electrical Testing 

-Digital, Linear, Memory, and MPU

-Linear IC, Op Amps, and Mixed Logic

-Microprocessors, DSPs, Microcomputers

-Memories, RAM, FPGA, ROM

-Transistor, Diode, Zener, SCR or Triac

-Passives capacitors, Resistor, Inductors

In addition to these services we can also offer solderability,speed grade verification, LVDS LCD testing, temp screening, baking and dry packing, and tape and reel service.